Make signals perfect— High Performance Connectivity Solution
Rx Bridge IC. MIPI C/D PHY → LVDS with 1:4deserialization. Core IC for camera frame grabbers andCIS wafer test. 64 ICs/DUT card confirmed for SamsungLSI.
Wafer-Level Probing
Each CIS die is tested before dicing. Probe cardscarry up to 64 MPR02K ICs to receive full-speedMIPI C/D PHY signals simultaneously frommultiple dies. DUT-to-IC distance: 10–50 cm. IC-to-FPGA: coaxial cable 1.5–2 m.
End-of-Line Inspection
Complete camera modules are tested on high-speed assembly lines before shipping. The testmust run at full sensor operating speed to catchevery defect class. Lines run 365 days, 24 hours —Bridge Boards are consumable componentsreplaced continuously.
Pattern Generation
OLED and AMOLED panels are verified by injectingknown test patterns via MIPI DSI. MPX01K convertsthe FPGA's digital output into MIPI C/D PHY signalsthat drive Display Driver ICs (DDIs) directly duringpanel manufacturing.
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